Front side hot-swap chassis management module
US7173817B2 · kind B2 · utility
13Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 29, 2003 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Aug 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20736
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular platform is provided. The modular platform includes a chassis having a front side and a back side, and configured to receive modular platform boards, a plenum associated with the chassis and at least one chassis management module removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.