Wen Wei
10Patents
6h-index
10Co-inventors
55Inventor score
Filing activity: Mar 6, 1998 → May 19, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6538888B1 | Radial base heatsink | Emerging Cross-Sectional Technologies | 48 | Expired |
| US7209351B2 | Telecom equipment chassis using modular air cooling system | Electricity | 41 | Expired |
| US7126820B2 | Modular platform system and apparatus | Electricity | 22 | Expired |
| US7424396B2 | Method and apparatus to monitor stress conditions in a system | Physics | 21 | Active |
| US7173817B2 | Front side hot-swap chassis management module | Electricity | 13 | Expired |
| US6072887A | Receiver-transmitter of communication equipment | Electricity | 12 | Expired |
| US7274571B2 | Heatsink | Electricity | 5 | Expired |
| US7283921B2 | Modeling module | Electricity | 4 | Expired |
| US7401737B2 | Apparatus and method for a mobile personal computer system (MPC) with a built-in scanner | Electricity | 3 | Expired |
| US8189343B2 | Method and apparatus to provide power to a backplane | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.