Method for analyzing manufacturing data
US7174281B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 1, 2002 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Jun 4, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06Q10/043
- WIPO fieldIT methods for management
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing, e.g., integrated circuits, and of managing a manufacturing process. Product unit (circuit) variation data is collected from clustered product units (wafer sites). Collected data is grouped according to a selected manufacturing parameter. Each group is normalized for the selected manufacturing parameter. Normalized groups are combined. Normalized process data is checked for variances and the data is regrouped and renormalized until variances are no longer found. Each identified variance is correlated with a likely source. Then, each said likely source is addressed, e.g., a tool is adjusted or replaced, to minimize variances.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.