Semiconductor module
US7176579B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2003 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Oct 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.