Method for forming a tunable piezoelectric microresonator
US7179392B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 5, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Sep 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a resonator including the steps of: forming on an insulating substrate a first portion of a conductive material and a second portion of another material on the first portion; forming an insulating layer having its upper surface flush with the upper part of the second portion; forming by a succession of depositions and etchings a beam of a conductive material above the second portion, the beam ends being on the insulating layer on either side of the second portion, the upper surface of the second portion being exposed on either side of the beam, a third portion of a piezoelectric material on the beam and a fourth portion of a conductive material on the third portion above the beam portion located above the second portion; and removing the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.