Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
US7179684B2 · kind B2 · utility
9Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2005 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Jul 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.