Surface acoustic wave device, package for the device, and method of fabricating the device
US7180228B2 · kind B2 · utility
4Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2004 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Jun 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, and a package housing the surface acoustic wave chip, a first surface of the package including an opening of the cavity being wider than a second surface of the package opposite to the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.