Shingo Masuko
13Patents
3h-index
27Co-inventors
56Inventor score
Filing activity: Feb 13, 2004 → Mar 12, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7304417B2 | Package for electronic device, base substrate, electronic device and fabrication method thereof | Electricity | 6 | Expired |
| US7200924B2 | Method of packaging electronic parts | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7180228B2 | Surface acoustic wave device, package for the device, and method of fabricating the device | Electricity | 4 | Expired |
| US7528522B2 | Surface acoustic wave device, package for the device, and method of fabricating the device | Electricity | 3 | Expired |
| US8558244B2 | Semiconductor device and method for manufacturing semiconductor device | Electricity | 2 | Active |
| US7215065B2 | Surface acoustic wave device, package for the device, and method of fabricating the device | Electricity | 2 | Expired |
| US9966311B2 | Semiconductor device manufacturing method | Electricity | 0 | Active |
| US9953894B2 | Semiconductor device and manufacturing method thereof | Electricity | 0 | Active |
| US9054171B2 | HEMT semiconductor device | Electricity | 0 | Active |
| US9412825B2 | Semiconductor device | Electricity | 0 | Active |
| US8916881B2 | Semiconductor device and method for manufacturing semiconductor device | Electricity | 0 | Active |
| US10784165B2 | Semiconductor device and dicing method | Electricity | 0 | Active |
| US9472467B2 | Manufacturing method of semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.