Probe head with machined mounting pads and method of forming same
US7180316B1 · kind B1 · utility
13Cited by
1References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2006 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Feb 3, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.