TOUCHDOWN TECHNOLOGIES, INC.
22Patents
15Active
22Granted
45Portfolio score
Filing activity: Mar 19, 2002 → Mar 20, 2008 · 15 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7264984B2 | Process for forming MEMS | Performing Operations; Transporting | 45 | Expired |
| US7271022B2 | Process for forming microstructures | Performing Operations; Transporting | 15 | Expired |
| US7180316B1 | Probe head with machined mounting pads and method of forming same | Physics | 13 | Expired |
| US7791361B2 | Planarizing probe card | Physics | 11 | Active |
| US7245135B2 | Post and tip design for a probe contact | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7365553B2 | Probe card assembly | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7378734B2 | Stacked contact bump | Electricity | 7 | Active |
| US7589547B2 | Forked probe for testing semiconductor devices | Physics | 7 | Active |
| US7759952B2 | Method of forming probe card assembly | Emerging Cross-Sectional Technologies | 4 | Active |
| US7692436B2 | Probe card substrate with bonded via | Emerging Cross-Sectional Technologies | 4 | Active |
| US7355422B2 | Optically enhanced probe alignment | Physics | 4 | Active |
| US7362119B2 | Torsion spring probe contactor design | Physics | 4 | Expired |
| US7589542B2 | Hybrid probe for testing semiconductor devices | Physics | 4 | Active |
| US7724010B2 | Torsion spring probe contactor design | Physics | 3 | Active |
| US7538567B2 | Probe card with balanced lateral force | Physics | 1 | Active |
| US7759951B2 | Semiconductor testing device with elastomer interposer | Electricity | 1 | Active |
| US7728612B2 | Probe card assembly and method of forming same | Emerging Cross-Sectional Technologies | 1 | Active |
| US7761966B2 | Method for repairing a microelectromechanical system | Emerging Cross-Sectional Technologies | 1 | Active |
| US7365551B2 | Excess overdrive detector for probe cards | Physics | 0 | Active |
| US6970616B2 | Optical cross-connect assembly | Physics | 0 | Expired |
| US7772859B2 | Probe for testing semiconductor devices with features that increase stress tolerance | Physics | 0 | Active |
| US7922888B2 | Post and tip design for a probe contact | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.