High-speed chip-to-chip communication interface
US7180949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2003 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Aug 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L25/0292
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A high-speed parallel interface for communicating data between integrated circuits is disclosed. The interface is implemented by a transmitter and receiver pair and a single-ended parallel interconnect bus coupling to the transmitter and receiver pair. As opposed to transmitting small swing signals over differential signal lines, the transmitter transmits data to the receiver at full swing over the single-ended parallel interconnect bus. The invention can be implemented with simple CMOS circuitry that does not consume large die area. Accordingly, many link interfaces can be implemented on a single chip to provide a large data bandwidth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.