Patent · US Expired

Device for joining substrates

US7182116B2 · kind B2 · utility

0Cited by

4References

10Claims

0Family size

Assignee

Steag Hamatech AG · US

Inventors

Alexander Hupp · Eppingen, DE
Ulrich Speer · Eisingen, DE
Roland Wagner · Feldkirchen-Westerham, DE
Frank Michels · Kleve, DE

Key dates

Filing date	Mar 1, 2002
Grant date	Feb 27, 2007
Priority date	—
Expiry date	Jun 1, 2022

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2017/005
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

An apparatus is provided for joining together substrates, which have an inner hole, to form a substrate disk. An expandable element is introducible into the inner hole of at least two superimposed substrates. The element is expandable to such an extent that it can come into contact with the inner holes of both of the substrates to close off an intermediate space formed between the substrates relative to the environment. A substrate support is rotatable about an axis of rotation perpendicular to a support surface thereof. A centering device is rotatably coupled with the substrate support and is movable relative thereto in the direction of the axis of rotation. The expandable element is disposed, and is compressible, between the substrate support and the centering device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.