Pick and place assembly for transporting a film of material
US7182118B2 · kind B2 · utility
13Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2003 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Jun 2, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a pick and place assembly for transferring a film of material. The assembly comprises a collet having a substantially convex contact surface for contacting the film, the collet including a vacuum suction device operative to generate a force to hold the film. The film may comprise a thermoplastic adhesive tape or B-stage thermoset epoxy coated film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.