Physical nano-machining with a scanning probe system for integrated circuit modification
US7183122B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | May 19, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Jul 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Nano-machining for circuit edits through the front side or backside of an integrated circuit may be performed using a scanning probe system. The system may create access holes with smaller dimensions and facilitate nano-machining endpoint detection in some embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.