Semiconductor device and method of manufacturing the same
US7183639B2 · kind B2 · utility
33Cited by
5References
36Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 12, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Aug 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.