Optical probes with spacing sensors for the wafer level testing of optical and optoelectronic chips
US7183759B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Dec 17, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4224
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This application describes, among others, wafer designs, testing systems and techniques for wafer-level optical testing by coupling probe light to/from the top of the wafer. During the optical testing, the vertical spacing between an optical probe and the wafer is set to a very close distance, to achieve efficient optical coupling. It is beneficial to keep this close distance during optical testing as a constant in testing different optical components at different locations on the wafer. In one implementation, a spacing sensor may be used to measure the height of the optical probe from the wafer surface. This sensor may be a capacitance sensor that is mounted at the optical probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.