Wireless radio frequency technique design and method for testing of integrated circuits and wafers
US7183788B2 · kind B2 · utility
10Cited by
73References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 1, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Mar 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is for an apparatus and method for the wireless testing of Integrated Circuits and wafers. The apparatus comprises a test unit external from the wafer and at least one test circuit which is fabricated on the wafer which contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising a variable ring oscillator, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.