Method and structure reducing parasitic influences of deflection devices in an integrated spatial light modulator
US7184195B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2005 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Jun 15, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/047
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of fabricating an integrated spatial light modulator with contact structures. The method includes providing a first substrate having a bonding surface, providing a device substrate having a device surface, and depositing a first layer on the device surface, the first layer having an upper surface opposite the device surface. The method also includes patterning the first layer to define a plurality of contact structure openings, depositing a conductive layer on the upper surface of the first layer, reducing the thickness of the conductive layer, and removing at least a portion of the first layer to expose a plurality of contact structures. The method further includes depositing a standoff layer on the first layer, forming standoff structures from the standoff layer, and joining the bonding surface of the first substrate to the standoff structures to form a bonded substrate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.