Apparatus for thermally coupling a heat dissipation device to a microelectronic device
US7185420B2 · kind B2 · utility
5Cited by
4References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 7, 2002 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Mar 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device to provide the desired thermal profile to effect solidification of the interface material from the center outward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.