Steve Mayer
6Patents
3h-index
6Co-inventors
46Inventor score
Filing activity: Jun 7, 2002 → Nov 3, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7964506B1 | Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers | Electricity | 37 | Active |
| US7185420B2 | Apparatus for thermally coupling a heat dissipation device to a microelectronic device | Emerging Cross-Sectional Technologies | 5 | Expired |
| US10821367B2 | Interactive gaming via mobile playmaker | Electricity | 4 | Active |
| US7506795B2 | Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device | Emerging Cross-Sectional Technologies | 3 | Active |
| US9358463B2 | Interactive gaming via mobile playmaker | Electricity | 0 | Active |
| US11376511B2 | Interactive gaming via mobile playmaker | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.