Efficient analysis of organic additives in an acid copper plating bath
US7186326B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2004 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | May 6, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is performed first and the suppressor concentration in the resulting measurement solution is adjusted to a predetermined value corresponding to full suppression. This fully-suppressed solution is then used as the background electrolyte for the anti-suppressor analysis. This integrated analysis approach provides results comparable to those obtained with cell cleaning and rinsing between the analyses but significantly reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.