Glass-ceramic materials and electronic packages including same
US7186461B2 · kind B2 · utility
4Cited by
51References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 18, 2005 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Mar 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0306
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A glass-ceramic is provided having a thermal expansion coefficient in a range of 4.0 to 8.5 ppm/° C., a dielectric constant in a range of 5–7 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO2 in a range of 40–55 wt %, Al2O3 in a range of 7–22 wt %, MgO in a range of 6 to less than 26 wt %, and at least one of BaO in an amount up to 35 wt %, SrO in an amount up to 37 wt % and ZnO in an amount up to 17 wt %. An electronic package is also provided, including one of a metal and sintered ceramic base member and a glass-ceramic substrate bonded to the base member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.