Methods for forming conductive bumps and wire loops
US7188759B2 · kind B2 · utility
13Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2005 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Sep 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the deposited conductive bump. The method also includes moving the bonding tool to contact the conductive bump such that a location of the junction is moved with respect to the bonding location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.