Method for reduction of defects in wet processed layers
US7189146B2 · kind B2 · utility
5Cited by
16References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2003 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Apr 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed process solution to a processing unit or degassing the process solution in-situ, within the processing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.