Substrate heating device
US7189946B2 · kind B2 · utility
16Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Apr 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate heating device is provided, including a ceramic base plate having a heating surface on which a substrate is placed, resistance heating elements buried in the ceramic base plate corresponding to a plurality of zones into which the heating surface is divided, terminals respectively connected to the resistance heating elements, and lead wires respectively connected to the terminals and wired on an outer surface of the ceramic base plate other than the heating surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.