Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same
US7190060B1 · kind B1 · utility
62Cited by
86References
115Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2003 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Oct 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first semiconductor chip and a first lead that is bent outside the first insulative housing. The second device includes a second insulative housing, a second semiconductor chip and a second lead that is flat outside the second insulative housing. The conductive bond contacts and electrically connects the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.