Semiconductor chip assembly with embedded metal pillar
US7190080B1 · kind B1 · utility
47Cited by
149References
115Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2003 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | May 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally from the pillar towards the chip, the pillar includes tapered sidewalls, and the chip and the pillar are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.