Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
US7190580B2 · kind B2 · utility
63Cited by
15References
29Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Nov 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.