Resin composition and prepreg for laminate and metal-clad laminate
US7192651B2 · kind B2 · utility
6Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2004 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Apr 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.