Multilayered construction for resistor and capacitor formation
US7192654B2 · kind B2 · utility
9Cited by
10References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 22, 2005 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Mar 27, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.