Thermal micro-valves for micro-integrated devices
US7195036B2 · kind B2 · utility
71Cited by
2References
11Claims
0Family size
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Key dates
| Filing date | Oct 30, 2003 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Jul 29, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/4643
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
The movement and mixing of microdroplets through microchannels is described employing silicon-based microscale devices, comprising microdroplet transport channels, reaction regions, electrophoresis modules, and radiation detectors. The discrete droplets are differentially heated and propelled through etched channels. Electronic components are fabricated on the same substrate material, allowing sensors and controlling circuitry to be incorporated in the same device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.