CMP porous pad with component-filled pores
US7195544B2 · kind B2 · utility
26Cited by
25References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2004 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Jun 21, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a polishing pad comprising a polymeric material having pores and a component that is disposed within the pores, as well as a method of polishing a workpiece with the aforesaid polishing pad, and a method for producing the aforesaid polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.