Schottky diode device with aluminum pickup of backside cathode
US7195952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2005 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Mar 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a semiconductor chip having a passivation layer forming the top surface of the semiconductor chip and a metal pad formed on the passivation layer and a discrete electronic device having a first terminal formed on a first surface and a second terminal formed on a second surface opposite the first surface of the discrete electronic device where the first surface of the discrete electronic device is attached to the metal pad using a conductive adhesive structure. The semiconductor chip and the discrete electronic device are encapsulated in an encapsulation material. An electrical connection is formed between the metal pad and one of a bond pad of the semiconductor chip or a package post of the integrated circuit package. In one embodiment, the metal pad is an aluminum pad and a metal line connects the metal pad to a bond pad of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.