Electrochemical fabrication methods using transfer plating of masks
US7195989B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2004 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | May 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76838
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Three-dimensional structures are electrochemically fabricated by depositing a first material onto previously deposited material through voids in a patterned mask where the patterned mask is at least temporarily adhered to a substrate or previously formed layer of material and is formed and patterned onto the substrate via a transfer tool patterned to enable transfer of a desired pattern of precursor masking material. In some embodiments the precursor material is transformed into masking material after transfer to the substrate while in other embodiments the precursor is transformed during or before transfer. In some embodiments layers are formed one on top of another to build up multi-layer structures. In some embodiments the mask material acts as a build material while in other embodiments the mask material is replaced each layer by a different material which may, for example, be conductive or dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.