Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package
US7196294B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2006 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Feb 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during operation. The resistive bridge is preferably coupled to a high supply voltage used to power the package. Resistors R1 and R2 are connected in series at a first junction between the high and low supply voltages and a resistor R3 is coupled to the high supply voltage and connected in series with the resistance of the solder-network at a second junction. The network is held at a low voltage on the die. The detector compares the sensitivity and detection voltages and outputs a Pass/Fail signal for the solder-joint network.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.