Image sensor package
US7196322B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2004 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Jun 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
An image sensor module includes a substrate, frame layer, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface, and a lower surface on which second electrodes are formed. The frame layer is arranged on the upper surface of the substrate, a cavity formed between the frame layer and substrate. The photosensitive chip is mounted on the upper surface of the substrate and located within the cavity. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder from the upper end face to the lower end face, the upper end of the opening is formed with an internal thread and the lower end of the opening is formed with a breach, so that the internal diameter of the upper end of the opening is smaller than the lower end of the opening, the lens holder is adhered on the upper surface of the substrate by glue, therefore, the frame layer is located within the breach of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread is screwed to the internal thread of the lens holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.