Method to monitor pad wear in CMP processing
US7198546B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Oct 13, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad groove analyzer and associated method configured to assess the grooves on the pad and determine how worn the pad is. The pad groove analyzer may be configured to monitor the grooves via a contact or no-contact process. In a contact process, the pad groove analyzer may include a stylus which physically contacts and moves along the pad. As the stylus falls into the grooves in the pad as the stylus moves along the pad, signals are created, and a stylus monitor uses the signals to determine to what extent the pad is worn. The stylus monitor can be configured to communicate with the general tool controller. In a no-contact process, the pad groove analyzer may take several different forms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.