Wafer planarization composition and method of use
US7198560B2 · kind B2 · utility
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24References
10Claims
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Key dates
| Filing date | Nov 28, 2005 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Nov 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.