Patent · US Expired

Method of fabricating a combined fully-depleted silicon-on-insulator (FD-SOI) and partially-depleted silicon-on-insulator (PD-SOI) devices

US7198993B2 · kind B2 · utility

4Cited by
9References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 13, 2004
Grant dateApr 3, 2007
Priority date
Expiry dateSep 30, 2025

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D86/01

Abstract

A method (100) of forming fully-depleted (90) and partially-depleted (92) silicon-on-insulator (SOI) devices on a single die in an integrated circuit device (2) is disclosed using SOI starting material (4, 6, 8) and a selective epitaxial growth process (110).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.