Method of fabricating a combined fully-depleted silicon-on-insulator (FD-SOI) and partially-depleted silicon-on-insulator (PD-SOI) devices
US7198993B2 · kind B2 · utility
4Cited by
9References
14Claims
0Family size
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Key dates
| Filing date | Dec 13, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Sep 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/01
Abstract
A method (100) of forming fully-depleted (90) and partially-depleted (92) silicon-on-insulator (SOI) devices on a single die in an integrated circuit device (2) is disclosed using SOI starting material (4, 6, 8) and a selective epitaxial growth process (110).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.