Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy
US7199342B2 · kind B2 · utility
0Cited by
23References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2003 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Nov 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.