Semiconductor device with improved heat dissipation, and a method of making semiconductor device
US7199467B2 · kind B2 · utility
3Cited by
13References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 6, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | May 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member is made of metal and deformable to absorb a stress generated between the semiconductor chip and the heat dissipation member, the coupling member and the semiconductor chip being joined through metal-metal bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.