Method of packaging electronic parts
US7200924B2 · kind B2 · utility
4Cited by
5References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 13, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Oct 28, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49794
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating electronic parts includes the steps of: mounting electronic elements in regular cavities that are two-dimensionally arranged on a baseboard on which dummy cavities are provided so as to surround the regular cavities, and covering a top of the baseboard with a resin sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.