Wafer chucking apparatus for spin processor
US7201176B2 · kind B2 · utility
0Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2006 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Apr 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.