Electronic module with form in-place pedestal
US7202571B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Dec 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electrically coupled to at least one of the conductive traces. The underfill material is positioned between the component and the substrate and provides at least one pedestal that supports the component during encapsulation. The underfill material, when cured, maintains the integrity of the electrical connections between the component and the conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.