Defect inspection apparatus and defect inspection method
US7205555B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2005 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Jan 24, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/225
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and a method for automatically inspecting a defect by an electron beam using an X-ray detector. The composition of a defective portion is analyzed with higher rapidity and the cause of the defect is easily and accurately determined based on an X-ray spectrum. The X-ray spectrum and the image of foreign particles formed on a process QC wafer are registered as reference data, and the defects generated on a process wafer are classified by collation with the reference data. The use of both the X-ray spectrum and the detected image optimizes the operating conditions for X-ray detection. A defect of which the X ray is to be detected is selected based on the result of classification of defect images automatically collected, and the defect is classified according to the features including both the composition and the external appearance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.