Thermally enhanced stacked die package and fabrication method
US7205651B2 · kind B2 · utility
28Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2004 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Apr 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die is electrically connected to the substrate, and the first die, the heat sink, and the second die are encapsulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.