Apparatus and method for measuring spectral reflectance and apparatus for measuring film thickness
US7206074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2005 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Jul 28, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0625
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A film thickness measurement apparatus has an image pickup part (32) for acquiring a plurality of single-band images corresponding to a plurality of wavelengths, and the image pickup part (32) acquires a plurality of reference single-band images representing a pattern on a reference substrate. A correction factor setting part (51) performs setting of a plurality of correction factors in accordance with distances from a specified pixel by using a plurality of reference single-band images. Subsequently, the image pickup part (32) acquires a plurality of measurement single-band images representing a pattern on an objective substrate and corrects a value of the specified pixel for each of a plurality of measurement single-band images by using the value of the specified pixel and values of pixels surrounding the specified pixel and the correction factors. A spectral reflectance calculation part (52) thereby calculates a reflectance at a measurement point on the objective substrate which corresponds to the specified pixel on the basis of the corrected value of the specified pixel with high accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.