Method of manufacturing high performance copper inductors with bond pads
US7207096B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2004 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Jan 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing high performance copper inductors includes providing a tall, Cu laminate spiral inductor is formed at the last metal level, and at the last metal +1 level, with the metal levels being interconnected by a bar via having the same spiral shape as the spiral metal inductors at the last metal level and the last metal +1 level. The method includes integrating the formation of thick inductors with the formation of bond pads, terminals and interconnect wiring with the last metal +1 wiring. Included are dielectric deposition and spacer formation steps, and/or selective deposition of a passivating metal such as CoWP, to passivate a Cu inductor that is formed after the last metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.