Patent · US Expired

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

US7208347B2 · kind B2 · utility

9Cited by

5References

16Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Norbert Seliger · Munich, DE
Karl Weidner · Birkenfeld, DE
Jörg Zapf · Munich, DE

Key dates

Filing date	Jan 26, 2004
Grant date	Apr 24, 2007
Priority date	—
Expiry date	Jan 26, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.