Electrostatic chuck for an electrically insulative substrate, and a method of using same
US7209339B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 28, 2004 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Oct 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electrostatic chuck for attracting an insulative substrate to be processed, the electrostatic chuck comprising a dielectric layer having a first surface which attracts an insulative substrate, and a second surface on which are provided a plurality of electrodes, and an insulative support base plate fixing said dielectric layer. A distance between adjacent ones of the electrodes and the thickness of the dielectric layer are adjusted such that when a potential difference is established between the electrodes, a non-uniform electric field is formed in which the insulative substrate is partially polarized and attracted to the first surface by gradient force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.